Important DatesJune 15, 2019
Submission Deadline (Full Paper)June 20, 2019
Submission Deadline (Abstract)July 1, 2019
Notification DateJuly 10, 2019
Registration DeadlineJuly 15, 2019
Camera-ready DueJuly 20, 2019
Registration Deadline (Listener)
Conference Date & Venue
July 10, 2019! The conference venue changed. (Click)
June 15, 2019! The deadline for last round submission is today.
May 1, 2019! Welcome Prof. Daolun Chen who will give an invited speech for ICMESM 2019.
February 25, 2019! Welcome Prof. Jesus Toribio who will give a keynote speech for ICMESM 2019.
February 5, 2019! Welcome Assoc. Prof. Marina Rynkovskaya who will give an invited speech for ICMESM 2019.
January 25, 2019! Welcome Prof. Sergei Alexandrov who will give a keynote speech for ICMESM 2019.
November 25, 2018! ICMESM2019 will be held in Salamanca, Spain during August 9-12, 2019.
August 15, 2018! Congratulations! So Yeong Choi (Gangneung-Wonju National University, South Korea), Chien-Jen Tang (Feng Chia University, Taiwan) and Wan-Chin Yu (National Taipei University of Technology, Taiwan) won the best presentation awards.
Successfully held in Singapore, Beijing (China), and Okinawa (Japan) in the past three years, ICMESM is an annual conference which explores the development and implications in the related fields of Material Engineering and Smart Materials with an objective to present the novel and fundamental advancements. As a workshop of ICDMM 2019, it serves to foster communication among researchers and practitioners working in a wide variety of scientific areas with a common interest in improving Material Engineering and Smart Materials related techniques.
2019 4th International Conference on Material Engineering and Smart Materials (ICMESM 2019) will be held in Salamanca, Spain during August 9-12, 2019. It is sponsored by International Association of Computer Science and Information Technology and technically assisted by University of Salamanca, University of the Ryukyus, etc. Featured with invited speeches, oral presentations, poster presentations, academic visit and social networking event, ICMESM 2019 welcomes submission of researches concerning any branch of Material Engineering and Smart Materials and the participation of anyone who are interested in these fields.
Salamanca is a magical destination that boasts top-rate
history, culture, food and attractions. Its Old City was
declared a UNESCO World Heritage Site in 1988.
University of Salamanca makes it well known
worldwide—the first university in Spain and the fourth
oldest university in the world. This one factor would
contribute to the city’s growth and prominence as a
major cultural center and renaissance city in Europe up
until the 17th century.
Congratulation that 3 best presenters from ICMESM 2018 are awarded with 50% discount of registration fee at ICMESM 2019.
1. So Yeong Choi, Gangneung-Wonju National
University, South Korea
Paper Title: Characteristics of Flexural Behavior of Reinforced Concrete Member Substituted Heavyweight Waste glass as Fine aggregate
2. Chien-Jen Tang, Feng Chia University, Taiwan
Paper Title: Thermochromic properties of vanadium oxide films prepared by R-HIPIMS using closed-loop controlled with plasma emission monitoring
3. Wan-Chin Yu, National Taipei University of Technology, Taiwan
Paper Title: Morphology Modulation of ZnO Hierarchical Structures for Dye-Sensitized Solar Cells
The conference is open to public (one needs to register first). In general, there are 4 types of participants to this conference, which are given as follows:
Making a presentation at the conference and publishing the paper.
*Submit your Full Paper (no less than 6 pages) first to start with; Click to submit your paper via Online Submission System.
Making a presentation only at the conference without paper publication.
*Submit your paper abstract (200-400 words) first to start with; Click to submit your abstract via Online Submission System.
Participating in the conference only without presentation or paper publication.
You can register directly through the electronic system or enquiry from conference secretary at the mail box
4. Sponsors / Partners
If you are interested in sponsoring or cooperating with ICMESM 2019, please contact us at email@example.com.
Accepted papers of ICMESM 2019 will be published in volume of Materials Science Forum (ISSN:1662-9752), which indexed by SCOPUS, Ei Compendex, Cambridge Scientific Abstracts, Chimica, ProQuest, WorldCat, Google Scholar, etc.